1、

Module level micro architecture design and RTL implementation. Chip level integration.

模块级微架构设计以及RTL实现, 片级整合.

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2、

However, this term is used almost exclusively to refer to micro controllers with on chip PROM.

然而, 这个术语一般被专有地使用在拥有片上PROM的微控制器上.

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3、

A process of soft lithography was introduced for fabrication of PDMS ( polydimethylsiloxane ) micro-mixer on micro-fluidic chip.

介绍了一种用软光刻技术制作微流芯片上 PDMS 微混合器的工艺.

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4、

A new technology of micro-systemsystempackage ( SIP ) is introduced , and compared with system on chip ( SoC ).

阐述了SIP的优势和应用, 指出 SIP 将会为微系统集成技术带来更大的发展.

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5、

This high reliability micro-controller compatible instruction system and addressing way of 51 Series signal chip microcomputer, and add security auxiliary module in original structure.

这款微控制器兼容51系列单片机的指令系统和寻址方式,在原始微控制器的架构中加入可以起到安全防护功能的辅助模块。

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6、

A Single Chip Micro-computer Controlled Instrument for The Dielectric Oil Breakdown Voltage Test

单片机控制绝缘油击穿电压测试仪

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7、

The software method is introduced by employing DDFS technology to realize the transformation of digital signal into FFSK signal. The conventional DDFS technology is improved a lot to achieve its function on single chip micro-computer without using too much resources.

采用直接数字频率合成(DDFS)技术,实现数字信号转换成FFSK信号的软件方法,对常用DDFS技术进行改进,使其能够在通用型单片机上实现而无需占用太多资源。

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8、

In this paper we report the analysis of underfill encapsulation between the solder ball, micro-chip and substrate by experiment and3D mold flow simulation.

文中主要探讨了覆晶封装底胶充填时,锡球、芯片及基板间的流动状况。

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